universal-science-newlogo
divider-optimizer
t-pad thermal interface
  • Thermal pad
  • Guarantees thermal performance suitable for high power products 6.5 W/mK
  • Suitable to solve any imperfections of the application surfaces
  • Recommended for high power concentrated in limited space (e.g. COB)
  • Available with thickness 0.2mm
  • Die-cut material on drawing